Atheros ar7010.


Atheros ar7010





Atheros ar7010.


Intel considers reverse lithography as an alternative to EUV

Faced with delays in the development of EUV lithography, Intel decided to play it safe by paying attention to technologies that can open up the potential for the use of optical scanners in technological processes with norms up to 22 nm.

Specifically, Intel is working on what the company calls “computational lithography.”. According to the source, this is a variant of the so-called reverse lithography. Reverse lithography, EUV and double patterning are among the candidates Intel is evaluating as a technology for 22nm (32nm half-step) logic chips.

Reverse lithography, as its name implies, is based on the reverse motion in the manufacture of masks, starting from the given results. Simply put, the shape of the mask is “calculated” from the pattern that it should leave on the plate as a result of exposure. This approach is associated with the development of special algorithms and intensive mathematical operations. On the other hand, it allows to solve many problems arising in the transition to conditions when the elements formed during lithography should be significantly less than the radiation wavelength used for exposure, and, as expected, will help extend the effect of optical lithography beyond 45 nm.

In other words, reverse lithography will help delay the need for EUV lithography, which is already late due to technical problems. Now Intel plans to master the use of EUV for the production of 22nm logic chips by 2021.

Until EUV technology is ready. Moreover, since the timing of its expected readiness corresponds to the timing of the industry’s expected transition to 22nm norms, some observers doubt that EUV will even reach the stage of practical application. In addition to purely technical problems, there are others – for example, the high cost of equipment for EUV: experts call the numbers about 70-100 million. Doll.

Source: EE Times

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