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TSMC Launches 0.13μm Embedded Flash

Taiwan Semiconductor Manufacturing Company (TSMC) Announces Mass Production of 0.13-μm Embedded Flash. Thus, TSMC became the first among companies exclusively engaged in the production of semiconductor products, which mastered the serial technical process of embedded flash memory, which is fully compatible with the manufacturing process of logic circuits.

The fabrication of 0.13-micron embedded flash uses the same memory cells as the previous generation, simplifying the migration to new regulations, TSMC says. Full compatibility is declared with the TSMC basic process technology used for the production of universal logic circuits according to the 0.13 micron (G) standard and its variation optimized for the production of devices with low power consumption (LP). In this way, customers can make the best use of their investment in content libraries and intellectual property (IP) designs.

According to Sam Chen, director of marketing for memory platforms at TSMC, the low-voltage product option is great for ZigBee / Wibree devices, wireless headsets, hearing aids, smart cards and other applications that require ultra-low power consumption at supply voltages 1. 2-1.5V.

Source: TSMC

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